TY  - BOOK
AU  - Ma,Yue
AU  - Gontrand,Christian
TI  - Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement
U1  - 621.381531 
PY  - 2019///
CY  - Boca Raton
PB  - CRC Press, Taylor & Francis Group
KW  - Three-dimensional integrated circuits
N1  - Includes bibliographical references and index
ER  -