| 000 | 00708cam a2200205 i 4500 | ||
|---|---|---|---|
| 999 |
_c812 _d812 |
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| 001 | 20677072 | ||
| 003 | OSt | ||
| 005 | 20251027105708.0 | ||
| 008 | 250424b ||||| |||| 00| 0 eng d | ||
| 040 | _cNMSCST | ||
| 082 | 0 | 0 |
_a621.381531 _bM111 2019 |
| 100 | 1 |
_aMa, Yue, _eauthor. |
|
| 245 | 1 | 0 |
_aPower, thermal, noise, and signal integrity issues on substrate/interconnects entanglement / _cYue Ma and Christian Gontrand. |
| 264 | 1 |
_aBoca Raton : _bCRC Press, Taylor & Francis Group, _cc2019. |
|
| 300 |
_axiii, 226 pages : _bill. |
||
| 504 | _aIncludes bibliographical references and index. | ||
| 650 | 0 | _aThree-dimensional integrated circuits. | |
| 700 | 1 |
_aGontrand, Christian, _eauthor. |
|
| 942 |
_2ddc _cCIR |
||