Normal view MARC view ISBD view

Ma, Yue,

Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement / Yue Ma and Christian Gontrand. - xiii, 226 pages : ill.

Includes bibliographical references and index.

Subjects--Topical Terms:
Three-dimensional integrated circuits.

Dewey Class. No.: 621.381531 / M111 2019