Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement / Yue Ma and Christian Gontrand.

By: Ma, Yue [author.]
Contributor(s): Gontrand, Christian [author.]
Publisher: Boca Raton : CRC Press, Taylor & Francis Group, c2019Description: xiii, 226 pages : illSubject(s): Three-dimensional integrated circuitsDDC classification: 621.381531
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Item type Current location Home library Collection Call number Vol info Status Date due Barcode Item holds
CIRCULATION BOOK COLLEGE LIBRARY
COLLEGE LIBRARY
RESERVED SECTION 		NON-FICTION 621.381531 M111 2019 (Browse shelf) 10925 Available 10925
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Includes bibliographical references and index.

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