Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement / Yue Ma and Christian Gontrand.
By: Ma, Yue [author.]
Contributor(s): Gontrand, Christian [author.]
Publisher: Boca Raton : CRC Press, Taylor & Francis Group, c2019Description: xiii, 226 pages : illSubject(s): Three-dimensional integrated circuitsDDC classification: 621.381531| Item type | Current location | Home library | Collection | Call number | Vol info | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|---|---|
| CIRCULATION BOOK | COLLEGE LIBRARY | COLLEGE LIBRARY RESERVED SECTION | NON-FICTION | 621.381531 M111 2019 (Browse shelf) | 10925 | Available | 10925 |
Total holds: 0
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| 621.381044 P887 2016 c.2 Power electronics/ edited by Maurice Willis. | 621.3815 A533 2019 Electronic devices and circuits / | 621.3815 S531 2019 Analog and digital electronics/ | 621.381531 M111 2019 Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement / | 621.382 S257 2019 c.1 Multimedia processing and communications : audio and video / | 621.382 S257 2019 c.2 Multimedia processing and communications : audio and video / | 621.3822 S531 2020 Fundamentals of digital signal processing / |
Includes bibliographical references and index.
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